Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-08-10
2002-12-31
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S767000, C361S785000, C361S803000, C361S764000, C439S082000, C439S083000, C439S070000, C439S063000, C439S876000, C174S257000, C174S657000, C174S657000, C174S657000
Reexamination Certificate
active
06501665
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an improved structure of a ball grid array IC mounting seat, and in particular, an IC mounting seat having a plurality of conductive clipping plates with clipping solder ball structure so as to eliminate the requirement of pre-soldering of solder ball onto the conductive clipping plates
2. Description of the Prior Art
Ball Grid Array IC mounting seat is a new mounting seat structure with solder balls to replace the mounting seat bottom of the insertion pins, and surface mounting technology is employed to mount the corresponding soldering position of the solder balls over the surface of the circuit board.
FIG. 1
is a perspective view of Ball Grid Array CPU mounting seat.
FIG. 2
is a bottom view of FIG.
1
. The number of mounting pins of the corresponding IC pins is changed to semi-engaging seat bottom of the solder balls
11
,
12
,
13
, such that the bottom surface of the CPU mounting seat is protruded from the hemisphere of the plurality of solder balls
11
,
12
,
13
.
FIG. 3
is a combination view of the BGA CPU mounting seat of a conventional solder ball structure. Within the mounting seat
10
, corresponding to IC pins, a plurality of straight slots
20
,
21
,
22
are formed. Each straight slot
20
,
21
,
22
is squeezed with a bending, U-shaped conductive clipping plate
30
of the elastic thin strap. The bottom end of the conductive clipping plate
30
does not protrude from the bottom of the seat
10
, and, from the bottom section of the folded arch, a solder ball
40
is mounted such that the upper hemisphere of the solder ball
40
is engaged at the straight slot
20
and is mounted to the conductive clipping plate
30
, and the lower hemisphere of the solder ball
40
is used for future mounting of a circuit board
50
to the soldering point. At an appropriate position on the two side walls of the conductive clipping plate
30
, at least a pair of circular arch walls
31
,
32
is provided for clipping with the IC pins
61
,
62
of a top transverse board
60
mounted onto the seat
10
. This conductive plate
30
together with the ball solder
40
has the following drawbacks:
a. Soldering process is required to pre-mount the solder ball
40
onto a conductive clipping plate.
b. More than one procedures of soldering of solder ball
40
are required.
Accordingly, it is an object of the present invention to provide an improved structure of a ball grid array IC mounting seat which mitigates the above drawbacks.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an improved structure of a ball grid array IC mounting seat, wherein an IC mounting seat for Ball Grid Array (BGA) has a plurality of conductive clipping plates corresponding to a plurality rows of IC pins to match with a plurality of solder balls, the conductive clipping plate is an elastic elongated thin strap and has a middle section being bent to form two parallel side walls for clipping the physical body of the IC pins.
Yet another object of the present invention is to provide an improved structure of a ball grid array IC mounting seat, wherein the pre-soldering of the solder ball onto the conductive clipping plate is avoided, and the production process is rapid.
A further object of the present invention is to provide an improved structure of a ball grid array IC mounting seat, wherein the number of time of soldering procedures is reduced and the contamination of the solder balls is minimized, and the quality of soldering is stable.
These and other advantages of the present invention will become clear to those skilled in the art upon a study of the detailed description of the invention and of the several figures of the drawings.
REFERENCES:
patent: 6280219 (2001-08-01), Sano et al.
patent: 6352437 (2002-03-01), Tate
Gandhi Jayprakash N.
Lei Leong C.
Lotes Co., Ltd.
Tran Thanh Y.
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