Metal packages having improved thermal dissipation

Details Metal packages having improved thermal dissipation Metal packages having improved thermal dissipation

1987-08-31

1990-10-02

Hille, Rolf

357 78, 357 81, 357 82, H01L 2302, H01L 2312

Patent

active

049611062

ABSTRACT:
A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.

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