Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2000-12-28
2002-10-22
Elve, M. Alexandra (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S180500, C228S001100, C228S009000
Reexamination Certificate
active
06467673
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a bonding apparatus and bonding method, and more specifically relates to an apparatus and method for accurately calculating the amount of offset of two processing members such as a tool and a position detection camera which detects the bonding position, etc.
2. Prior Art
Below, a wire bonding apparatus will be described as one example. A position detection camera which detects the positions of the bonding points on a semiconductor device, and a bonding arm which has a tool that performs bonding attached to one end, are installed on a bounding head which is mounted on an XY table. Furthermore, the position detection camera and bonding arm are attached to the bonding head with the optical axis of the position detection camera and the axial center of the tool shifted by a fixed distance so that the tool and bonding arm will not interfere with the visual field of the position detection camera when position detection camera detects the position of a bonding point. Generally, the distance between the optical axis of the position detection camera and the axial center of the tool is referred to as the “offset” of these two components.
The position detection camera determines a reference point that is used in order to ascertain the position to which the tool is moved. Accordingly, it is extremely important to ascertain the distance by which the position detection camera is offset from the tool. However, since the actual offset amount varies from instant to instant as a result of thermal expansion of the camera holder and bonding arm caused by radiant heat from the high-temperature bonding stage, it is necessary to calibrate the amount of offset when bonding operations are initiated and at an appropriate timing during the bonding operations.
For this purpose, in the bonding method and apparatus proposed in Japanese Patent No. 2982000 owned by the applicant of the present application, a reference member is disposed in a specified position, a position detection camera is moved to a point above the reference part of this reference member, and the positional relationship between this reference part and the optical axis of the position detection camera is measured; furthermore, the tool is moved to a point above the reference part in accordance with an amount of offset that is stored beforehand in memory, and the positional relationship between the reference part and the tool is measured by an offset correction camera; then, the accurate amount of offset is determined by correcting the above-described amount of offset that is stored beforehand in memory. In this structure, the amount of offset between the position detection camera and the tool can be determined with good precision by way of the use of the reference member.
A substantially cylindrical projection is used as one example of the reference member in this structure, and the reference member and tool are measured from the side by the offset correction camera in a state in which both of these parts are caused to face each other. However, since the discrepancy between the reference member and the tool also has a component in the Y direction as well as the X direction, it is necessary to use two offset correction cameras that measure X-direction and Y-direction images in order to use such a projection-form reference member. As a result, a large installation space is required, which leads to an increase in the size of the apparatus.
SUMMARY OF THE INVENTION
The present invention is to solve the problems.
The object of the present invention is to provide an apparatus and method which requires no offset correction cameras even in a case where a projection-form reference member is used.
The above object is accomplished by a first unique structure for a bonding apparatus that comprises:
a reference member disposed in a specified position in the bonding apparatus;
a single image detection member which detects the reference member;
optical members which conduct images to the image detection member, the images being of a processing member that processes an object of processing and of the reference member and being acquired from a plurality of different directions; and
an operational processing unit which calculates positional coordinates of the processing member and the reference member based upon images of the processing member and the reference member which are acquired from the plurality of different directions and are picked up by the image detection member.
In the above, the optical members which conduct images of the processing member and reference member that are acquired from a plurality of different directions to the image detection member. As a result, it is not necessary to use two image detection members even in a case where a projection-form reference member is used. In the following description in this specification, the term “processing member” includes detection members such as cameras, etc. in addition to working heads that perform physical working processes on semiconductor devices.
The above object is further accomplished by a second unique structure of the present invention for a bonding apparatus wherein a first processing member and a second processing member are installed so as to be offset from each other, and the bonding apparatus comprises:
a reference member disposed in a specified position;
a single, image detection member used for offset correction, the image detection member detecting the reference member;
optical members which conduct images of the first or second processing member, or both, and of the reference member to the image detection member used for offset correction; the images being acquired from a plurality of different directions; and
an operational control device which determines accurate amount of offset based upon:
(a) a measured value obtained by measuring a positional relationship between one of the processing members and the reference member, the processing members being the first and second processing members and in a first attitude in which the first or second processing member is caused to approach the reference member;
(b) a measured value obtained by way of measuring images of another of the processing members and of the reference member with the image detection member used for offset correction, the processing members being the first and second processing members and in a second attitude in which another of the processing members is caused to approach the reference member, and the images being acquired from a plurality of different directions and conducted to the image detection member used for offset correction by the optical members; and
(c) amounts of movement of the first and second processing members between the first attitude and the second attitude.
In the above second structure of the present invention, the operational control device determines the accurate amount of offset on the basis of (a) a measured value obtained by measuring the positional relationship between one of the processing members, i.e., the first or second processing member and the reference member, in a first attitude in which the first or second processing member is caused to approach the reference member, (b) a measured value obtained by using the image detection member used for offset correction to measure images of the other of the processing members, i.e., the first or second processing member, and the reference member in a second attitude, in which the other of the processing members, i.e., the first or second processing member, is caused to approach the reference member, and these images being acquired from a plurality of different directions which are conducted to the image detection member used for offset correction by the optical members, and (c) the amounts of movement of the first and second processing members between the first attitude and the second attitude. Thus, since images of the first or second processing member and the reference member that are acquired from a plurality of different directions are conducted
Enokido Satoshi
Hayata Shigeru
Kyomasu Ryuichi
Sasano Toshiaki
Elve M. Alexandra
Kabushiki Kaisha Shinkawa
Koda & Androlia
Tran Len
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