Optoelectronic component

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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Details

C385S094000

Reexamination Certificate

active

06461058

ABSTRACT:

FIELD OF INVENTION
This invention relates to an optoelectronic component. It is particularly relevant to a component, such as an optical transceiver, used as a part of a fibre optic optical transmission system.
PRIOR ART
Optoelectronic devices are electronic devices adapted to generate or receive optical radiation. Typical generating devices are semiconductor lasers and light emitting diodes, and a typical receiving device is a photodiode. A main use for optoelectronic devices is in fibre optic communications systems, in which signals are generated in one optoelectronic device (a transmitter) and received in another optoelectronic device (a receiver), between which the signals are transmitted through a network of fibres, switches and other routing components, and amplifiers. A further kind of optoelectronic device is a transceiver, adapted to both transmit and receive (generally, a transceiver will contain a transmitter element and a receiver element, each for connection to separate fibres of a network).
Optoelectronic devices are being designed for ever greater speeds of operation (generally in accordance with developing industry standards) in order to increase the rate of information transmission achievable through fibre optic networks. Achievement of greater speeds of operation, however, creates problems. Optoelectronic devices, and other types of electronic device, will generally emit electromagnetic radiation m operation, typically in the radio frequency. A requirement placed on optoelectronic devices is that such emissions of radiation fall below a threshold value (defined in EMC standards such as FCC class B). If the speed of the optoelectronic device increases, the amount of electromagnetic radiation increases, and the relevant EMC standard becomes more difficult to meet.
It is even more difficult to meet the EMC standard when electromagnetic radiation is generated not only by the optoelectronic device, but also by other electronic components within the same enclosure as the optoelectronic device (especially when these electronic components are also high speed components). Appropriate enclosure structures to provide EMC shielding are well known. However, it is difficult to achieve an effectively shielded enclosure for an optoelectronic component, as it is necessary for an effective optical connection to be made between the optoelectronic component and fibres of an fibre optic communications network.
In addition to these requirements, it is desirable for components such as optical transceivers to be manufacturable at minimum cost (both with low cost optoelectronic devices and with inexpensive manufacturing and assembly requirements). It is therefore desirable to achieve effective EMC shielding in a low cost, easily manufactured and assembled optoelectronic component.
SUMMARY OF INVENTION
Accordingly, the invention provides an optoelectronic component, comprising one or more optoelectronic devices, a metallic or metallized housing within which the one or more optoelectronic devices are mounted; an optical connector to allow optical radiation to be coupled between the one or more optoelectironic devices and fibres of a fibre optic communications network, wherein the optical connector is disposed within an aperture in the housing; and a metallic or metallized barrier disposed between the one or more optoelectronic devices and the optical connector substantially to shield against transmission of electromagnetic radiation through the aperture, except for the transmission of optical radiation to be provided to or received from the fibre optic communications network.
With this arrangement, effective electromagnetic shielding is provided even for the connector aperture, and hence for the whole component. Advantageously, the metallic or metallized barrier is electrically connected to at least a part of the metallic or metallized housing.
In a preferred arrangement, electrical and optical elements of the optoelectronic component are provided on separate substrates. (preferably printed circuit board substrates). Shielding is then most advantageously provided by providing separate conductive housings as shields for each of the optical and electrical components—in which case the metallized housing may contain electrically isolated parts which form parts of the separate conductive housings, and in which case the barrier may form a part of the conductive housing for the optical components.
It is particularly preferred that the metallic or metallized barrier be a part of a structural element of the optoelectronic component. In particular, the barrier may be a part of a clip used to connect parts of the optoelectronic component together—for example, to retain the optical assembly on the housing.


REFERENCES:
patent: 4913511 (1990-04-01), Tabalba et al.
patent: 5047835 (1991-09-01), Chang
patent: 5233676 (1993-08-01), Yonemura et al.
patent: 5285512 (1994-02-01), Duncan et al.
patent: 5596663 (1997-01-01), Ishibashi et al.
patent: 5966487 (1999-10-01), Gilliland et al.
patent: 6078465 (2000-06-01), Kodama
patent: 6085006 (2000-07-01), Gaio et al.

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