Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2000-06-07
2002-07-23
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000
Reexamination Certificate
active
06423574
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention is concerning a method of manufacturing diodes with ceramic base and dice structure especially referring to a method of arraying the dice on the base with vibrator and packing resistors synchronally as well as forming dice array formation including diodes, resistors and capacitors therein.
The applicant has devoted himself to manufacture diodes for years, and a patent application titled “METHOD OF MANUFACTURING DIODES” was filed at the United States Patent & Trademark Office on Jul. 27, 1999 with filing Ser. No. 09/361,520, it has also been issued a Notice of Allowance by U.S.P.T.O. on Mar. 13, 2000.
Referring to
FIGS. 37-40
, they comprise the steps of:
(1) cutting grooves
101
on a ceramic base
10
to form hundreds of units
102
;
(2) applying a layer of conductive paste all over salient of each of the unit
102
except a portion close to the right edge thereof to form lower layer conductors
20
;
(3) adhering dice
30
to the lower layer conductors
20
of the base
10
;
(4) applying covering materials
40
to the base
10
and the dice
30
; letting the covering materials
40
to expose, developing the covering materials, and then removing the film to uncover the salient
301
of each die
30
and the grooves
101
;
(5) applying a layer of the conductive paste all over the salient
301
of the dice
30
except a portion close to the left edge thereof to form upper layer conductors
50
;
(6) coating protective glue
60
on the top of the units
102
;
(7) serving the base
10
into a plurality of elongated rectangular blocks
103
, and cauterizing the blocks
103
to form terminals
70
on both lateral, and then linking them with the lower layer conductors
20
and the upper layer conductors
50
; and,
(8) cleaving the blocks
103
to be a single diode
80
from the grooves
101
of the base
10
.
For making this invention more satisfied, an improved method of manufacturing diodes with ceramic base is provided.
SUMMARY OF THE INVENTION
Therefore, this invention is related to an improved method of manufacturing diodes with ceramic base.
The first object of the present invention is to provide an improved method, which can array dice on the ceramic base with a vibrator so as to benefit to automatic manufacturing.
The second object of the present invention is to provide an improved method, which a fixed die and resistor can be brought to the package during the same manufacturing.
The third object of the present invention is to provide an improved method, which is to form the combination of dice array, numerous dice can be packed at a time, and the dice can be diodes, resistors, capacitors and inductors. By this way, the convenience and efficiency increases, and more additional values can be created.
REFERENCES:
patent: 6122170 (2000-09-01), Hirose et al.
patent: 6159771 (2000-12-01), Sheng-Hsiung
patent: 363113369 (1988-05-01), None
Dang Phuc T.
Nelms David
Rosenberg , Klein & Lee
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