Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2000-12-26
2002-05-07
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S907000
Reexamination Certificate
active
06383844
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a multi-chip bonding method and apparatus used in the manufacturing process of hybrid semiconductor devices.
2. Prior Art
In hybrid semiconductor devices, as shown in
FIG. 2
, semiconductor chips
2
A and
2
B of different types, e.g., two types, are mounted on a substrate
1
. Prior art multi-chip bonding methods and apparatus for such mounting of semiconductor chips
2
A and
2
B of different types on a substrate
1
will be described below.
As shown in
FIG. 3
, the first method is a method in which wafer rings
4
(
4
A,
4
B . . . ) or trays are exchanged for each individual substrate
1
. The case of wafer rings will be described below.
As shown in
FIG. 3
, a wafer
3
pasted to the surface of a wafer sheet (not shown) is split longitudinally and laterally into a lattice form, and the wafer sheet is stretched so that individual semiconductor chips
2
(
2
A,
2
B . . . ) are formed. The outer circumferential portion of the wafer sheet is attached to a wafer ring
4
(
4
A,
4
B . . . ). The wafer rings
4
(
4
A,
4
B . . . ) are accommodated in a wafer ring cassette
5
in which the rings are stacked in a vertical configuration with a fixed spacing maintained between the individual wafer rings, and this wafer ring cassette
5
is positioned and held in an elevator device (not shown). Here, wafer rings
4
A,
4
B . . . which have different types of semiconductor chips
2
A,
2
B . . . are accommodated in the wafer ring cassette
5
. In other words, a wafer ring
4
A which has semiconductor chips
2
A, a wafer ring
4
B which has semiconductor chips
2
B, and so on, are accommodated.
A holding device
6
for holding wafer rings, trays, etc. (merely called “holding device
6
”) is installed at a fixed distance from the wafer ring cassette
5
on the side of the accommodation opening of the wafer ring cassette
5
. A push-up needle (not shown) which pushes the semiconductor chips
2
(
2
A,
2
B . . . ) upward is installed beneath the pick-up position
7
of this holding device
6
. The wafer rings
4
(
4
A,
4
B . . . ) inside the wafer ring cassette
5
are chucked by a wafer ring conveying means (not shown) and are thus conveyed to the holding device
6
, where the wafer rings are positioned and held. Furthermore, the wafer rings
4
(
4
A,
4
B . . . ) that are held by the holding device
6
are chucked by wafer ring conveying means and accommodated in their original positions in the wafer ring cassette
5
.
The above-described wafer ring cassette
5
, elevator device (not shown) that positions and holds the wafer ring cassette
5
, holding device
6
, and wafer ring conveying means (not shown) are described in, for example, Japanese Patent Application Laid-Open (Kokai) Nos. H9-64147 and H9-64148. In Japanese Patent Application Laid-Open (Kokai) No. H9-64147, guide rails (wafer ring holder) for guiding wafer rings are vertically movable and horizontally rotatable near the wafer ring cassette, and the guide rails are set to be horizontal at the same height when the wafer is carried. In Japanese Patent Application Laid-Open (Kokai) No. H9-64148, a sensor for detecting wafer rings is provided on either the upper or lower claw provided in the wafer ring conveying means.
Meanwhile, the substrates
1
are accommodated in the substrate cassette
11
of a loader section
10
. Each substrate
1
that is fed out from the substrate cassette
11
is conveyed by a substrate conveying device
12
. An adhesive material is dropped onto the bonding portions of this substrate
1
by an adhesive material dropping device
20
; then semiconductor chips (
2
A,
2
B . . . ) are bonded to the bonding portions by a bonding apparatus
30
, after which the substrate
1
is accommodate in the substrate cassette
14
of an unloader section
13
.
The adhesive material dropping device
20
has a pre-forming nozzle
21
which accommodates the adhesive material; this pre-forming nozzle
21
is installed so that it is moved upward and downward on the Y table
23
of a universally known XY table
24
that consists of an X table
22
and Y table
23
. The bonding apparatus
30
has a bonding tool
31
that holds the semiconductor chips
2
(
2
A,
2
B . . . ) by vacuum suction and bonds the chips to the substrate
1
. This bonding tool
31
is installed so that it is moved upward and downward on the Y table
33
of a universally known XY table
34
that consists of an X table
32
and Y table
33
.
Next, the operation of the above apparatus will be described. In order to simplify the description, a case in which two types of semiconductor chips
2
A and
2
B are bonded to each substrate
1
as shown in
FIG. 2
will be described.
The wafer ring
4
A inside the wafer ring cassette
5
is conveyed by the wafer ring conveying means (not shown) and is positioned and held by the holding device
6
. Then, the semiconductor chip
2
A that is to be picked up is moved to the pick-up position
7
.
Meanwhile, a substrate
1
inside the substrate cassette
1
1
of the loader section
10
is fed out onto the substrate conveying device
12
. When this substrate
1
is conveyed to the adhesive material dropping station of the adhesive material dropping device
20
by the substrate conveying device
12
and positioned in this station, an adhesive material is dropped onto the bonding portions (located in six places in the case of
FIG. 2
) of the substrate
1
by the movement of the XY table
24
of the adhesive material dropping device
20
in the directions of the X and Y axes and the upward and downward movement of the preforming nozzle
21
.
Next, when the substrate
1
onto which the adhesive material has been dropped is conveyed to the bonding station of the bonding apparatus
30
by the substrate conveying device
12
and is positioned in this bonding station, the bonding tool
31
of the bonding apparatus
30
vacuum-chucks a semiconductor chip
2
A on the wafer ring
4
A and is moved to point above the substrate
1
, after which the bonding tool
31
bonds this semiconductor chip
2
A to a bonding portion of the substrate
1
to which such a semiconductor chip
2
A is to be bonded, in accordance with a method which will be described below.
The vacuum-chucking of the semiconductor chip
2
A on the wafer ring
4
A by the bonding tool
31
, and the transfer and bonding of this chip to the substrate
1
, are performed as follows: the bonding tool
31
is moved to a point above the pick-up position
7
by the XY table
34
and is then lowered, and the push-up needle (not shown) disposed beneath the pick-up position
7
is raised. As a result, the semiconductor chip
2
A is pushed upward, and the bonding tool
31
chucks the semiconductor chip
2
A by vacuum suction. The bonding tool
31
is then raised and is moved by the XY table
34
to a point above the bonding portion of the substrate
1
to which the semiconductor chip
2
A is to be bonded. Next, the bonding tool
31
is lowered, and bonds the semiconductor chip
2
A to the bonding portion of the substrate
1
. Following this bonding, the vacuum of the bonding tool
31
is cut off, and the bonding tool
31
is raised. When the semiconductor chip
2
A is picked up from the wafer ring
4
A as described above, the next semiconductor chip
2
A that is to be picked up is moved to the pick-up position
7
.
Since four semiconductor chips
2
A are bonded to each substrate
1
shown in
FIG. 2
, the operation in which the bonding tool
31
vacuum-chucks a semiconductor chip
2
A from the wafer ring
4
A and bonds this semiconductor chip
2
A to a bonding portion of the substrate
1
is performed four times for each substrate
1
.
When the bonding of the semiconductor chips
2
A to the substrate
1
has been completed, the wafer ring
4
A held by the holding device
6
is conveyed by the wafer ring conveying device (not shown) and accommodated in its original position in the wafer ring cassette
5
. Next, the wafer ring cassette
5
is moved upward or downward by the elevator device
Kakutani Osamu
Mimata Tsutomu
Jones Josetta I.
Kabushiki Kaisha Shinkawa
Koda & Androlia
Niebling John F.
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