Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-05-16
2002-05-28
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
06396693
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a heat sink adapted to dissipate heat from a CPU.
In order to enhance the heat dissipation n efficiency of a heat sink, the heat dissipation area must be relatively increased.
FIG. 1
shows a heat sink according to the prior art. This structure of heat sink is extruded from aluminum, comprising a flat bottom panel
11
and parallel radiation fins
12
perpendicularly extended from the top surface of the flat bottom panel
11
. In order to increase the heat dissipation area, the radiation fins
12
are made as longer as possible. However, due to aluminum extrusion technical problem, there is a limitation to the length of the radiation fins
2
.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat sink, which provides a big heat dissipation area to dissipate heat efficiently. According to one aspect of the present invention, the heat sink comprises a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together. According to another aspect of the present invention, the top heat sink unit has a circular top recess and two locating grooves at two sides of the circular top recess for the mounting of a fan.
REFERENCES:
patent: 4800956 (1989-01-01), Hamburgen
patent: 5838065 (1998-11-01), Hamburgen et al.
patent: 5912802 (1999-06-01), Nelson
patent: 6009938 (2000-01-01), Smith et al.
patent: 6062301 (2000-05-01), Lu
LandOfFree
Heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2902356