Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2000-12-26
2002-05-28
Talbott, David L. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S126000, C438S127000, C029S841000, C029S855000, C029S856000
Reexamination Certificate
active
06395584
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an improvement of IC package, and more particularly to the use of a flat plate mold with special treatment during IC package dispensing process, such that it is able to improve the surface flatness of an IC product after dispensing; and a heat sink can be attached to the flat plate mold to improve the heat-dissipating problem of IC product.
BACKGROUND OF THE INVENTION
In traditional plastic ball grid array (PBGA) package dispensing process, the surface of an IC package is not so smooth as that of a molding process.
Please refer to
FIG. 1
, which shows the traditional manufacturing processes of a liquid encapsulated plastic ball grid array, and has steps as below:
(
1
.
1
) Preparation of a substrate
1
(
1
.
2
) Mounting IC chip
2
(die attach)
(
1
.
3
) Bonding wire
3
(
1
.
4
) Dispensing liquid dam resin
4
(
1
.
5
) Filling liquid resin
5
(
1
.
6
) Mounting balls
6
Due to the surface tension of liquid resin
5
, it is possible to form an arc or spherical shape on the surface of resin
5
after solidification. The non-flatness of the resin surface will directly affect the quality of laser marking or ink marking. Also in traditional IC package dispensing process, there. is no such a way of attaching heat sink. Therefore, the heat dissipation of a dispensing-type product will become a serious problem.
OBJECTS OF THE INVENTION
Therefore, one of the objects of the present invention is to adopt a flat plate mold with special coating treatment to flatten resin surface of IC package, such that the surface flatness of a dispensing-type IC product will be improved. The coating of flat plate mold is teflon or any other coatings which are hard to adhere with liquid resin. A vent or pin one dot is provided on the flat plate mold for venting away of liquid resin, solvent or diluent to avoid generation of voids. The pin one dot is used for recognition for a surface mount device. Therefore, after removing the flat plate mold, it is adapted to a marking process of the resin surface of IC package. A convex point will be formed on the resin surface simultaneously, which can be used as a marker for pin one dot.
Another object of the present invention is to adopt a metal flat plate mold, and in particular, to be designed with a heat sink. After the metal flat plate mold flattens the resin surface, the heat sink can contact with or approach to IC chip for heat dissipation. The metal flat plate is provided with a vent or pin one dot, and its inner surface can be treated by roughening or protruding process to increase the adhesion between heat sink and resin, and prevent from delamination.
A further object of the present invention is to adopt a flat plate mold structure with special design for the dispensing manufacturing of matrix array package (MAP). On the special flat plate mold, a vent or pin one dot has been provided for each IC in MAP respectively, to be adapted for the package of multiple chip modules (MCM) to increase the productivity of the process and raise the yield of the product.
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patent: 5904505 (1999-05-01), Hotta et al.
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patent: 5981312 (1999-11-01), Farquhar et al.
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Chung Chin-Hsing
Hsu Chi-Hsing
Hsu Wen-Fu
Bacon & Thomas
Chambliss Alonzo
FICTA Technology Inc.
Talbott David L.
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