Method for preparing diamond compacts containing single crystal

Abrasive tool making process – material – or composition – With inorganic material

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Details

51293, 51309, 72467, 76107A, 423446, B24D 302

Patent

active

042603978

ABSTRACT:
An improvement for making polycrystalline compacts containing single crystal diamonds embedded therein is disclosed. Cracking of such compacts is minimized by isolating the diamond in a relatively compressible matrix before exposing the sample to high pressure-high temperature sintering conditions. This may be done, for example, by mixing the diamond crystals with graphite or amorphous carbon powder. Useful devices which can be made from such compacts are cutting tools and wire drawing dies.
A sectional view of a wire die blank of this invention is depicted in FIG. 3. One single crystal diamond 12 is embedded in polycrystalline diamond matrix 14 which has been sintered within cemented tungsten carbide ring 16. The wire is drawn through aperture 18. It is felt that this type of die would improve the wire finish while helping to prevent the failure of the single crystal through cleavage. It is useful in drawing wires made of such materials as tungsten, copper coated steel, copper and nickel.

REFERENCES:
patent: 4129052 (1978-12-01), Bieberich
patent: 4144739 (1979-03-01), Corbin
patent: 4181505 (1980-01-01), De Vries et al.

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