Positive photosensitive resin composition comprising a polymer h

Details Positive photosensitive resin composition comprising a polymer h Positive photosensitive resin composition comprising a polymer h

1993-08-03

1995-06-27

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430165, 430190, 430191, 430193, 430910, G03F 7023, G03F 730

Patent

active

054278880

ABSTRACT:
A positive photosensitive resin composition contains 50 to 95 parts by weight of a resin (a) composed of a high molecular compound (A) having a molecular weight of 300 to 30,000 and an iodine value of 50 to 500 and containing carbon-carbon double bonds and a group represented by the formula (I) ##STR1## wherein R.sub.1 denotes a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms and X denotes a hydrogen atom or a bond, on the proviso that if X denotes the bond, a carbon atom linked to R.sub.1 and a carbon atom linked to a hydrogen atom together form a portion of a main chain of the high molecular compound (A), and a group represented by the formula (II) ##STR2## wherein R.sub.1 and X denote the same as above, and R.sub.2 denotes an alkyl, cycloalkyl or aryl group, and 5 to 50 parts by weight of a compound (b) containing quinone diazide groups.

REFERENCES:
patent: 4023973 (1977-05-01), Imaizumi et al.
patent: 4663268 (1987-05-01), Turner et al.
patent: 4720445 (1988-01-01), Brahim et al.
patent: 4845009 (1989-07-01), Kita et al.
patent: 5002858 (1991-03-01), Demmer et al.
patent: 5055374 (1991-10-01), Seio et al.
patent: 5059513 (1991-10-01), Hopf et al.
patent: 5068168 (1991-11-01), Lee
patent: 5212043 (1993-05-01), Yamamoto et al.

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