IC pickup, IC carrier and IC testing apparatus using the same

Classifying – separating – and assorting solids – Sorting special items – and certain methods and apparatus for... – Condition responsive means controls separating means

Reexamination Certificate

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C294S064200

Reexamination Certificate

active

06384360

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an IC pickup preferable for use for an IC testing apparatus for testing semiconductor integrated circuit devices and other various electronic components (hereinafter referred to as “ICs” representatively) and an IC carrier and IC testing apparatus using the same, more particularly relates to a compact IC pickup superior in operating response and an IC carrier and IC testing apparatus using the same.
2. Description of the Related Art
An IC testing apparatus called a “handler” conveys a large number of ICs held on a tray to the inside of the handler. There, the ICs are made to electrically contact a test head, then an IC tester unit (hereinafter referred to as a “tester”) is made to perform the test. When the test is ended, the ICs are conveyed from the test head and reloaded on trays in accordance with the results of the tests so as to sort them into categories of good ICs and defective ones.
Some conventional handlers are of a type provided with, in addition to trays for holding the ICs to be tested or the tested ICs (hereinafter referred to the “customer trays”), trays conveyed circulated inside the handler (hereinafter referred to as the “test trays”). In this type of handler, the ICs are reloaded between the customer trays and the test trays before and after the test.
The handler is provided with IC pickups for transferring ICs between the trays and pushing the ICs against the test head. A conventional IC pickup is comprised by a suction pad for picking up an IC by suction, a vacuum generator for impacting a suction force to the pickup pad, a control valve for controlling the ON/OFF state of the suction force by the vacuum generator, an actuator for making the pickup pad move up and down (for example, an air cylinder), and a control valve for driving the actuator.
In such a conventional IC pickup, however, the actuator having the suction pad attached to its front end was for example provided at the base of the X-Y conveyor of the handler, the control valve for driving the actuator was provided at a location other than at the base, and the vacuum generator and control valve were provided at still other locations, so a hose connecting the actuator and control valve and a hose connecting the suction pad and vacuum generator were necessary. Therefore, the distance between the drive and the control valve inevitably became longer and there was a problem in the response to a control signal.
Further, depending on the mounting positions of these parts, the arrangement of the hoses for connecting them also became difficult. Since the suction pad and actuator are operated by the X-Y conveyor, a length enabling their range of operation to be covered was necessary.
The present invention was made in consideration with these problems in the prior art and has as its object the provision of an IC pickup with components assembled compactly and superior in operating response and an IC carrier and IC tester using the same.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an IC pickup with components assembled compactly and superior in operating response and an IC carrier and IC testing apparatus using the same.
(1) According to the present invention, there is provided an IC pickup comprising at least a pad for picking up and holding an electronic component by suction, an actuator for making said pad operate, and a suction control valve for applying and releasing a suction force to and from said pad, wherein said pad, said actuator and said suction control valve are assembled into an integral unit.
With the IC pickup of the present invention, since the pad, actuator, and suction control valve are assembled into an integral unit, by attaching this unit to the base of the XY-conveyor, the IC pickup components can made compact and the hose connecting the pad and the suction control valve can be shortened, so the operating response can be improved.
The “assembly into an integral unit” spoken of in the present invention means not only building the pad, actuator, and suction control valve into a single part, but also joining these parts using screws or other connecting means. Therefore, when the stroke of motion of the pad differs and the suction force is the same, the pad and actuator may be changed and the same parts used for rest of the IC pickup.
Further, the suction control valve according to the present invention is a control valve for both imparting a suction force to the pad and releasing it and may be configured by a feed valve alone and also may be configured by a feed valve and break valve in combination. When the suction control valve is configured by a feed valve alone, the feed valve is operated when applying the suction force, while the air pressure serving as the source of the suction force is released to the atmosphere when releasing the suction force. As opposed to this, when desiring to improve the speed of pickup and release of an IC or when the IC is relatively light in weight, is possible to add a break valve to forcibly release the suction force.
(2) In the above invention, while not limited to this, a sensor for detecting the suction force of the pad may be further assembled into the integral unit. By assemblying the sensor for detecting the suction force into the integral unit, since the location of detection of the suction force is close to the pad, the accuracy of detection by the sensor becomes higher.
(3) In the above invention, as the suction force generator for imparting a suction force to the pad, it is also possible to use one outside of the pickup, but when providing a suction force generator able to be used for individual pickups or several pickups, it is preferable that a suction force generator be further assembled into the integral unit.
By doing this, the IC pickup components are made more compact and also the hoses and flow paths connecting the suction force generator and pad and the suction force generator and suction control valve can be made shorter and therefore the operating response improved.
(4) In the present invention, the actuator for making the pad move may be either of the electrically driven, electromagnetically driven or fluid pressure type. When using a fluid pressure cylinder, a cylinder control valve for controlling the drive action of the fluid pressure cylinder is preferably further assembled into the integral unit.
When using a fluid pressure cylinder as an actuator, a cylinder control valve for controlling the drive action of the fluid pressure cylinder becomes necessary, but by assembling this into the integral unit, not only can IC pickup components be made compact, but also the hoses and flow paths connecting the fluid pressure cylinder and cylinder control valve can be shortened and the operating response of the fluid pressure cylinder can be further improved.
(5) While not particularly limited to this, when using a fluid pressure cylinder as the actuator, the fluid pressure cylinder is preferably made one of a differential pressure control system such as with the IC pickup set forth in claim 5. By adopting this differential pressure control system, the cylinder control valve becomes more compact and the IC pickup can be made smaller in size.
(6) In the above invention, while not particularly limited to this, the IC pickup set forth in claim 8 is characterized in that at least several electrical signal wires among a plurality of electrical signal wires are connected to a single location.
Since the electrical signal wires for the actuator, suction control valve, sensor, etc. are comprised of a plurality of cables, by connecting these together at a single location, it is possible to share the power wires and as a result reduce the number of wires (number of core wires). In this case, in addition to connecting all of the plurality of electrical signal wires at just a single location, it is also possible to connect just some of the plurality of electrical signal wires together at a single location. If connecting all of the ele

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