Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2000-10-20
2002-01-15
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S128000, C438S129000, C716S030000, C716S030000
Reexamination Certificate
active
06338972
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention concerns integrated circuits (ICs) and IC design, and particularly relates to the utilization of off-grid metal layer resources on an integrated circuit.
2. Description of the Related Art
FIG. 1
provides a simplified cross-sectional view of an integrated circuit chip (or die)
10
, which includes a semiconductor layer
5
, three metal layers
1
to
3
, electrically insulating layers
7
, and passivation layer
8
. Semiconductor layer
5
, which is typically polysilicon, is used for forming the transistors and other electronic devices and also may be used for routing some of the electrical connections between these electronic devices. However, wire routing occupies space on the semiconductor layer
5
which otherwise could be used for the electronic devices. As a result, ordinarily only the shorter electrical connections are formed on semiconductor layer
5
. For the remainder of the connections, metal layers
1
to
3
are provided.
Metal layers
1
to
3
may be formed from any of a variety of materials including aluminum, copper or an electrically conductive alloy. Typically, two to four metal layers are formed on top of semiconductor layer
5
. To simplify the routing process, routing typically is performed using mainly horizontal and vertical trace (or wire) segments. Moreover, to permit such routing to be performed in an orderly manner, each metal layer typically is designated as either a horizontal metal layer or a vertical metal layer. Horizontal metal layers are used primarily for horizontal wire segments and vertical metal layers are used primarily for vertical wire segments. By routing wires in the metal layers
1
to
3
, electrical connections can be made without using valuable space on semiconductor layer
5
. Between metal layers
1
and
2
, between metal layers
2
and
3
, and between metal layer
1
and semiconductor layer
5
is an electrically insulating layer
7
, which typically is formed as an oxide film. Connections between metal layers or between the metal layers and connections between a metal layer, other than metal layer
1
, and semiconductor layer
5
are made using interlayer holes called vias. Direct contacts are made between semiconductor layer
5
and metal layer
1
.
Passivation layer
8
functions to prevent the deterioration of the electrical properties of the die caused by water, ions and other external contaminants. Typically, passivation layer
8
is made of a scratch-resistant material such as silicon nitride and/or silicon dioxide.
FIG. 2
provides a representational illustration of the layout of the logic portion
20
of integrated circuit die
10
. Logic portion
20
generally is located at the interior of die
10
. Typically, along the periphery of the IC die are I/O buffer cells (not shown) for interfacing with devices external to die
10
. As shown in
FIG. 2
, logic portion
20
is bordered by a power (VDD) ring
21
and a ground (VSS) ring
22
. Vertical power rails
24
bring power and vertical ground rails
25
bring ground to the internal logic electronic components from the power ring
21
and ground ring
22
, respectively. Specifically, as shown in
FIG. 2
, various logic cells
27
are arranged in cell columns
28
, with each cell column
28
being bordered by a power rail
24
and a ground rail
25
. Although
FIG. 2
shows a significant gap between cell columns
28
, the actual gap may in fact be much smaller. Overlaying cell columns
28
are channels
29
. For example, each channel
29
may be defined as the space from the left side of one cell column
28
to the left side of the next cell column
28
.
Each cell
27
includes one or more predetermined gates, flip-flops and/or other basic electronic devices. Also as shown in
FIG. 2
, each cell
27
typically has a standard width, although its length may be different from that of other cells. Although interior portion
20
is referred to herein as the logic portion of the IC and cells
27
are referred to herein as logic cells, this terminology is used merely to distinguish those cells from the I/O buffer cells. It should be understood that certain cells
27
may include some or all non-logic processing, such as analog signal processing.
Power and ground rings
21
and
22
and power and ground rails
24
and
25
usually are formed on the die's metal layers. In certain implementations, vertical wire segments are formed on metal layers
1
and
3
and horizontal wire segments are formed on metal layer
2
in addition to supplying power and ground, metal layers
1
to
3
also are used for routing electrical connections for carrying signals between and within the cells
27
.
In the layout described above, in which cell columns are used, the routing problem typically is separated into intra-column and inter-column routing. In intra-column routing, electrical connections are routed between electronic components in the same cell column, while in inter-column routing electrical connections are routed between cells in different cell columns. The routing problem is divided in this manner because the considerations involved in intra-column routing are usually different than the considerations involved in inter-column. Most of these considerations arise from the fact that a greater proportion of intra-column routing is performed over cells, as compared with inter-column routing. In addition because direct contacts can be formed between semiconductor layer
5
and metal layer
1
, there is no need to use vias, which typically occupy additional space, when routing over cells on metal layer
1
. Because most of intra-column routing is over cells, it is often preferable to perform as much intra-column routing on metal layer
1
as possible. Moreover, routing over cells often imposes additional wire spacing requirements, such as limitations on routing over noise-sensitive circuitry.
Thus, in one conventional technique metal layer
1
initially is used for intra-column routing. This technique is illustrated in
FIG. 3A
, which depicts intra-column routing on metal layer
1
for a single cell column
40
. Because point-to-point routing is performed entirely on metal layer
1
, horizontal trace segments, as well as vertical trace segments, are implemented on metal layer
1
, even though metal layer
1
is designated as a vertical metal layer. Moreover, metal layer
1
intra-column routing is performed independently of the grid used for cell placement and inter-column routing (as described below). In this regard, due to the absence of vias, the relatively fewer pins to connect and relatively smaller area in which to connect them, and the desire to perform as much intra-column routing as possible on metal layer
1
, the inefficiencies of grid-based routing generally are thought to outweigh its advantages for this purpose. For reference purposes, vertical grid lines
42
used for placement and inter-column routing (discussed below) are shown in FIG.
3
A. Corresponding horizontal grid lines also exist but are omitted from
FIG. 3A
for the sake of clarity.
In
FIG. 3A
, electrical connections are routed between the pins of cells
45
,
46
and
47
, as well as internally within those cells. As shown in
FIG. 3A
, routing is performed in a manner which tends to make the most efficient use of metal layer
1
, independent of the grid lines. Thus, for example, pin
50
of cell
46
is connected to pin
52
of cell
47
using a wire trace which consists of vertical wire segment
54
A, horizontal wire segment
54
B and vertical wire segment
54
C. As indicated above, each of segments
54
A,
54
B and
54
C is implemented on metal layer
1
.
FIG. 3B
illustrates inter-column routing in this technique. As shown in
FIG. 3B
, inter-column routing is generally grid-based, meaning that the axial line of each wire segment generally is required to lie along a grid line in a predetermined, regularly spaced rectangular grid. Use of such grid-based routing often greatly simplifies the routing problem. Thus, as shown in
FI
Sethuraman Anand
Sudhindranath Sira G.
Lindsay Jr. Walter L.
LSI Logic Corporation
Mitchell Silberberg & Knupp LLP
Niebling John F.
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