Method utilizing water soluble masking formulation for producing

Details Method utilizing water soluble masking formulation for producing Method utilizing water soluble masking formulation for producing

1993-03-29

1995-02-14

Beck, Shrive

Metal fusion bonding

Process

Using bond inhibiting separating material

228175, 427 96, 427404, 4274071, 427508, 427510, 427519, 427520, 156155, B05D 100, B23K 100

Patent

active

053887549

ABSTRACT:
A water-soluble coating or other deposit is produced from a formulation that is comprised of a curable liquid substance and a dispersed, particulate effervescing agent. The formulation is particularly useful as a solder resist in the manufacture of PCBs, and the preferred composition contains n-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, and polyvinylpyrrolidone.

REFERENCES:
patent: 4267202 (1981-05-01), Nakayama
patent: 4275092 (1981-06-01), Nakayama
patent: 4421782 (1983-12-01), Bolgiano
patent: 4741969 (1988-05-01), Hayama
patent: 4908230 (1990-03-01), Miller
patent: 5169675 (1992-12-01), Bartoszek-ioza
patent: 5225315 (1993-07-01), Grosclaude

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