Heat sink clip

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C024S458000, C165S185000, C248S510000, C257S727000

Reexamination Certificate

active

06341065

ABSTRACT:

BACKGROUND
1. Field of the Invention
The present invention relates to a clip, and particularly to a clip for a heat sink which readily attaches the heat sink to an electronic device.
2. The Related Art
Typical heat sinks are mounted to an outer surface of an electronic package, such as a central processing unit (CPU), to facilitate heat dissipation. Most heat sinks are thermally conductive, and have a plurality of fins to provide a large surface area which allows heat to be more efficiently dissipated by natural or forced convection. Heat sinks are mounted to electronic packages in a variety of ways, such as by a clip.
Referring to
FIG. 1
, a conventional clip
110
comprises a pressing body
114
and first and second arms
112
,
118
extending from opposite ends of the pressing body
114
. Each arm defines an aperture (not labeled) for engaging with a catch (not shown) formed on a socket on which a CPU is mounted. An operation section
116
is stamped on the second arm
118
, and extends in an opposite direction with respect to the second arm
118
. The operation section
116
is further bent to form a handle
119
.
In assembly, the aperture of the first arm
112
is first engaged with the corresponding catch. Then the handle
119
of the operation section
116
is depressed to cause the aperture of the second arm
118
to engage with the other catch, whereupon the pressing body
114
generates a spring force for pushing the heat sink onto the CPU. To remove the clip, the handle
119
is depressed, and the second arm
118
or the bottom portion of the operation section
116
is forced outward to disengage the aperture of the second arm
118
from the corresponding catch. However, this disassembly procedure is unnecessarily cumbersome and complicated.
Referring to
FIG. 2
, another conventional clip
120
comprises a first member
130
and a second member
140
coupled to the first member
130
. The first member
130
comprises a first arm
132
, a pressing portion
134
and a connecting portion
136
. The connecting portion
136
is barb-shaped for connecting with the second member
140
. The second member
140
comprises a second arm
142
defining a connecting aperture
144
for engaging the connecting portion
136
, and an operation portion
146
. However, the connecting portion
136
is easily broken away from the connecting aperture
144
when acted upon by an external force.
Related patents are disclosed in Taiwan Patent Applications Nos. 85211135 and 85214941, and U.S. Pat. Nos. 5,602,719 and 5,600,540.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip) for a heat sink which readily attaches/detaches the heat sink to/from an electronic device.
Another object of the present invention is to provide a clip for securely attaching a heat sink to an electronic device.
To achieve the above-mentioned objects, a heat sink clip comprises a body and a fastener. The body comprises a spring portion positioned above a heat sink, and two legs extending from opposite ends of the spring portion. Each leg defines an aperture for engaging a catch of a retention module positioned beside an electronic device. The spring portion has a horizontal section which forms a spring tongue. A pair of L-shaped guiding tabs is formed under and spaced from the horizontal section,thereby defining a space between the horizontal section and the guiding tabs. A gap is formed between the guiding tabs. The fastener includes an operation portion, and a connecting portion for insertion in the space between the horizontal section and the guiding tabs. The connecting portion defines a slot for engagement with the spring tongue of the body. A spring tab is formed under the connecting portion. When the spring tab is elastically deformed, it exerts a spring force between the heat sink and the clip, thereby securely attaching the heat sink to the electronic device.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:


REFERENCES:
patent: 5660562 (1997-08-01), Lin
patent: 6181559 (2001-01-01), Seo
patent: 6222734 (2001-04-01), Bookhardt et al.
patent: 6229705 (2001-05-01), Lee
patent: 6243265 (2001-06-01), Wong et al.

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