Method of manufacturing a light emitting device

Details Method of manufacturing a light emitting device Method of manufacturing a light emitting device

2008-05-27

2008-05-27

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C257S033000

Reexamination Certificate

active

07378291

ABSTRACT:
A technique capable of efficient, high speed processing for the formation of an organic compound layer by using an ink jet method is provided. In the method of forming an organic compound layer by using the ink jet method, a composition containing an organic compound having light emitting characteristics is discharged from an ink head, forming a continuous organic compound layer. The organic compound layer is formed on pixel electrodes aligned in a matrix shape, and is formed in a continuous manner over a plurality of pixel electrodes. A light emitting device is manufactured using organic light emitting elements in accordance with this manufacturing method.

REFERENCES:
patent: 5684365 (1997-11-01), Tang et al.
patent: 6013982 (2000-01-01), Thompson et al.
patent: 6057647 (2000-05-01), Kurosawa et al.
patent: 6283578 (2001-09-01), Popall et al.
patent: 6342275 (2002-01-01), Miyakawa et al.
patent: 6399226 (2002-06-01), Kitaguchi et al.
patent: 6420200 (2002-07-01), Yamazaki et al.
patent: 6440877 (2002-08-01), Yamazaki et al.
patent: 6533376 (2003-03-01), Gailus et al.
patent: 6575800 (2003-06-01), Kobayashi et al.
patent: 6821553 (2004-11-01), Miyashita et al.
patent: 6830494 (2004-12-01), Yamazaki et al.
patent: 6833156 (2004-12-01), Miyashita et al.
patent: 6843937 (2005-01-01), Kiguchi et al.
patent: 6872672 (2005-03-01), Yamazaki et al.
patent: 7063869 (2006-06-01), Yamazaki et al.
patent: 2002/0163562 (2002-11-01), Tanaka et al.
patent: 2002/0180372 (2002-12-01), Yamazaki
patent: 2003/0010283 (2003-01-01), Yamazaki et al.
patent: 2003/0016277 (2003-01-01), Hawkins et al.
patent: 2003/0030766 (2003-02-01), Kiguchi et al.
patent: 1212114 (1999-03-01), None
patent: 0 880 303 (1998-11-01), None
patent: 1 211 916 (2002-06-01), None
patent: 1 376 716 (2004-01-01), None
patent: 08-234683 (1996-09-01), None
patent: 10-012377 (1998-01-01), None
patent: 10-153967 (1998-06-01), None
patent: 10-189252 (1998-07-01), None
patent: 11-054270 (1999-02-01), None
patent: 11-074083 (1999-03-01), None
patent: 2001-085161 (2001-03-01), None
patent: 2003-007459 (2003-01-01), None
patent: 340978 (1998-09-01), None
patent: 406519 (2000-09-01), None
patent: WO 2006/073072 (2006-07-01), None
U.S. Appl. No. 09/580,485, filed May 30, 2000 is being submitted as related information.
U.S. Appl. No. 09/680,492, filed Oct. 6, 2000 is being submitted as related information.
T. Shimoda et al., “Multicolor Pixel Patterning of Light-Emitting Polymers by In-jet Printing”, SID 99 DIGEST, pp. 376-379.
Hsu, Che-H. et al., “5.4: A High Work Function Hole-Injection Material for Enhanced OLED Performance”, SID Digest '07: SID International Symposium Digest of Technical Papers, pp. 49-51.
Feehery, W. F., “69.1: Invited Paper: Solution Processing of Small-Molecule OLEDs”, SID Digest '06: SID International Symposium Digest of Technical Papers, pp. 1834-1836.
Hsu, Che-H. et al., “5.4: A High Work Function Hole-Injection Material for Enhanced OLED Performance”, SID Digest '06: SID International Symposium Digest of Technical Papers, vol. 38, pp. 49-51.
Feehery, W.F., “69.1: Invited Paper: Solution Processing of Small-Molecule OLEDs”, SID Digest '07: SID International Symposium Digest of Technical Papers, vol. 37, pp. 1834-1836.

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