Package for electronic device and method for manufacturing...

Details Package for electronic device and method for manufacturing... Package for electronic device and method for manufacturing...

2008-01-08

2008-01-08

Dang, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C438S106000

Reexamination Certificate

active

07317246

ABSTRACT:
A package for an electronic device equipped with an external terminal other than a terminal for mounting, includes a first internal terminal electrically connected to an external terminal other than the terminal for mounting and a second internal terminal connected to an external terminal for mounting for ground connection which is selectively connected to the internal terminal.

REFERENCES:
patent: 2004/0183191 (2004-09-01), Hamada
patent: 2005/0269911 (2005-12-01), Usada
patent: A 2000-77943 (2000-03-01), None
patent: A 2005-175848 (2005-06-01), None

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