Multi-chip semiconductor device with high withstand voltage,...

Details Multi-chip semiconductor device with high withstand voltage,... Multi-chip semiconductor device with high withstand voltage,...

2008-07-15

2008-07-15

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07399660

ABSTRACT:
A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed on the first semiconductor chip and is configured to integrate a power circuit to receive an external power supply and to supply an electric power to the first semiconductor chip based on the external power supply. The plastic mold seals together the first and second semiconductor chips on the substrate.

REFERENCES:
patent: 6410987 (2002-06-01), Kanemoto et al.
patent: 6642610 (2003-11-01), Park et al.
patent: 6903455 (2005-06-01), Sohn
patent: 63-175906 (1988-07-01), None
patent: 2004-103703 (2004-04-01), None

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