Removal of surface oxides by electron attachment for wafer...

Etching a substrate: processes – Forming or treating electrical conductor article

Reexamination Certificate

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C216S063000, C216S078000, C205S640000, C257SE21252

Reexamination Certificate

active

07387738

ABSTRACT:
The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

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