Methods of forming trench isolation in the fabrication of...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

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C438S437000, C257SE21548

Reexamination Certificate

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07368366

ABSTRACT:
The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated circuitry such as memory integrated circuitry.

REFERENCES:
patent: 3809574 (1974-05-01), Duffy et al.
patent: 3990927 (1976-11-01), Montier
patent: 4474975 (1984-10-01), Clemons et al.
patent: 4836885 (1989-06-01), Breiten et al.
patent: 5105253 (1992-04-01), Pollock
patent: 5156881 (1992-10-01), Okano et al.
patent: 5182221 (1993-01-01), Sato
patent: 5387539 (1995-02-01), Yang et al.
patent: 5410176 (1995-04-01), Liou et al.
patent: 5470798 (1995-11-01), Ouellet
patent: 5516721 (1996-05-01), Galli et al.
patent: 5518959 (1996-05-01), Jang et al.
patent: 5565376 (1996-10-01), Lur et al.
patent: 5604149 (1997-02-01), Paoli et al.
patent: 5616513 (1997-04-01), Shepard
patent: 5702977 (1997-12-01), Jang et al.
patent: 5719085 (1998-02-01), Moon et al.
patent: 5741740 (1998-04-01), Jang et al.
patent: 5770469 (1998-06-01), Uram et al.
patent: 5776557 (1998-07-01), Okano et al.
patent: 5786039 (1998-07-01), Brouquet
patent: 5786263 (1998-07-01), Perera
patent: 5801083 (1998-09-01), Yu et al.
patent: 5863827 (1999-01-01), Joyner
patent: 5883006 (1999-03-01), Iba
patent: 5888880 (1999-03-01), Gardner et al.
patent: 5895253 (1999-04-01), Akram
patent: 5895255 (1999-04-01), Tsuchiaki
patent: 5904540 (1999-05-01), Sheng et al.
patent: 5923073 (1999-07-01), Aoki et al.
patent: 5930645 (1999-07-01), Lyons et al.
patent: 5930646 (1999-07-01), Gerung et al.
patent: 5943585 (1999-08-01), May et al.
patent: 5950094 (1999-09-01), Lin et al.
patent: 5960299 (1999-09-01), Yew et al.
patent: 5972773 (1999-10-01), Liu et al.
patent: 5976949 (1999-11-01), Chen
patent: 5981354 (1999-11-01), Spikes et al.
patent: 5989978 (1999-11-01), Peidous
patent: 5998280 (1999-12-01), Bergemont et al.
patent: 6013583 (2000-01-01), Ajmera et al.
patent: 6030881 (2000-02-01), Papasouliotis et al.
patent: 6033961 (2000-03-01), Xu et al.
patent: 6051477 (2000-04-01), Nam
patent: 6069055 (2000-05-01), Ukeda et al.
patent: 6090675 (2000-07-01), Lee et al.
patent: 6127737 (2000-10-01), Kuroi et al.
patent: 6156674 (2000-12-01), Li et al.
patent: 6171962 (2001-01-01), Karlsson et al.
patent: 6187651 (2001-02-01), Oh
patent: 6190979 (2001-02-01), Radens et al.
patent: 6191002 (2001-02-01), Koyanagi
patent: 6245641 (2001-06-01), Shiozawa et al.
patent: 6265282 (2001-07-01), Lane et al.
patent: 6300219 (2001-10-01), Doan et al.
patent: 6326282 (2001-12-01), Park et al.
patent: 6329266 (2001-12-01), Hwang et al.
patent: 6331380 (2001-12-01), Ye et al.
patent: 6355966 (2002-03-01), Trivedi
patent: 6448150 (2002-09-01), Tsai et al.
patent: 6455394 (2002-09-01), Iyer et al.
patent: 6524912 (2003-02-01), Yang et al.
patent: 6534395 (2003-03-01), Werkhoven et al.
patent: 6583028 (2003-06-01), Doan et al.
patent: 6583060 (2003-06-01), Trivedi
patent: 6607959 (2003-08-01), Lee et al.
patent: 6617251 (2003-09-01), Kamath et al.
patent: 6674132 (2004-01-01), Willer
patent: 6719012 (2004-04-01), Doan et al.
patent: 6821865 (2004-11-01), Wise et al.
patent: 6930058 (2005-08-01), Hill et al.
patent: 6933225 (2005-08-01), Werkhoven et al.
patent: 7033909 (2006-04-01), Kim et al.
patent: 7053010 (2006-05-01), Li et al.
patent: 7141278 (2006-11-01), Koh et al.
patent: 2001/0006255 (2001-07-01), Kwon et al.
patent: 2001/0006839 (2001-07-01), Yeo
patent: 2001/0041250 (2001-11-01), Haukka et al.
patent: 2001/0046753 (2001-11-01), Gonzalez et al.
patent: 2002/0000195 (2002-01-01), Kao et al.
patent: 2002/0004284 (2002-01-01), Chen
patent: 2002/0018849 (2002-02-01), George et al.
patent: 2003/0032281 (2003-02-01), Werkhoven et al.
patent: 2003/0129826 (2003-07-01), Werkhoven et al.
patent: 2004/0016987 (2004-01-01), Sawada et al.
patent: 2004/0032006 (2004-02-01), Yun et al.
patent: 2004/0082181 (2004-04-01), Doan et al.
patent: 2004/0209484 (2004-10-01), Hill et al.
patent: 2004/0266153 (2004-12-01), Hu
patent: 2005/0009293 (2005-01-01), Kim et al.
patent: 2005/0009368 (2005-01-01), Vaarstra
patent: 2005/0054213 (2005-03-01), Derderian et al.
patent: 2005/0079730 (2005-04-01), Beintner et al.
patent: 2005/0112282 (2005-05-01), Gordon et al.
patent: 2005/0124171 (2005-06-01), Vaarstra
patent: 2005/0142799 (2005-06-01), Seo
patent: 0817251 (1998-01-01), None
patent: 959493 (1999-11-01), None
patent: 02277253 (1990-11-01), None
patent: 05-315441 (1993-11-01), None
patent: 06-334031 (1994-12-01), None
patent: 0146224 (1996-01-01), None
patent: 02/27063 (2002-04-01), None
patent: US04/021156 (2004-06-01), None
patent: U504/021156 (2005-12-01), None
Curtis et al, “APCVD TEOS: O3 Advanced Trench Isolation Applications”, Semiconductor Fabtech, 9thEd., p. 241-247.
George, S.M. et al., “Atomic layer controlled deposition of SiO2and Al2O3using ABAB . . . binary reaction sequence chemistry”, Applied Surface Science 82/83, Elsevier Science B.V., Jul. 10, 1994, p. 460-467.
Morishita et al. “Atomic-layer chemical-vapor-deposition of silicon-nitride”, Applied Surface Science 112, Elsevier Science B.V., 1997, p. 198-204.
Beekmann et al.,Sub-micron Gap Fill and In-Situ Planarisation using Flowfill™ Technology, Electrolech 1-7 ULSI Conference, Portland, OR (Oct. 1995).
Horie et al.,Kinetics and Mechanism of the Reactions of O(3P)with SiH3,CH2SiH3, (CH3)2SiH2,and(CH3)3SiH, 95 J. Phys. Chem 4393-4400 (1991).
Yokoyama et al. “Atomic layer controlled deposition of silicon nitride and in situ growth observation by infrared reflection absorption spectroscopy”, Applied Surface Science 112, Elsevier Science B.V., 1997, p. 75-81.
Gasser et al., “Quasi-monolayer deposition of silicon dioxide”, Elsevier Science S.A., 1994, p. 213-218.
Shareef et al., “Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2trench filling”, J. Vac. Sci. Technol. B 13(4), Jul./Aug. 1995, p. 1888-1892.
Kojima et al.,Planarization Process Using a Multi-Coating of Spin-on-Glass, V-MIC Conference, pp. 390-396 (Jun. 13-14, 1988).
Joshi et al.,Plasma Deposited Organosilicon Hydride Network Polymers as Versatile Resists for Entirety Dry Mid-Deep UV Photolithography, 1925 SPIE 709-720 (Jan. 1993).
Kiermasz et al.,Planarisation for Sub-Micron Devices Utilising a New Chemistry, Electrotech 1-2, DUMIC Conference, California (Feb. 1995).
U.S. Appl. No. 10/806,923, filed Mar. 2004, Li et al.
U.S. Appl. No. 10/931,524, filed Aug. 2004, Sandhu.
McClatchie et al.Low Dielectric Constant Flowfill™ Technology for IMD Applications, 7 pages (pre-Aug. 1999).
Matsuura et al.,Novel Self-planarizing CVD Oxide for Interlayer Dielectric Applications; 1994; 94 IEEE 117-120.
Disclosed Anonymous 32246, “Substrate Contact with Closed Bottom Trenches”, Research Disclosure, Feb. 1991, 1 page.
Matsuura et al.,A Highly Reliable Self-planarizing Low-k Intermetal Dielectric for Sub-quarter Micron Interconnects, 97 IEEE 785-788 (Jul. 1997).
Chen et al.,Excimer Laser-Induced Ti Silicidation to Eliminate the Fine-Line Effect for Integrated Circuitry Device Fabrication, 149 Journal of Electrochemical Society, No. 11, pp. G609-G612 (2002).
Nishiyama et al.,Agglomeration Resistant Self-Aligned Silicide Process Using N2Implantation into TiSl236 Jpn. J. Appl. Phys., Part 1, No. 6A, pp. 3639-3643 (Jun. 1997).
Wolf,Chapter 13: Polycides and Salicides of TiSix, CoSi2, and NiSi, Silicon Processing for the VLSI Era, vol. IV, pp. 603-604 (pre-2003).
Klaus et al.,Atomic Layer Deposition of SiO2Using Catalyzed and Uncatalyzed Self-Limiting Surface Reactions, 6 Surface Review and Letters, Nos. 3 and 4, pp. 435-448 (1999).
Withnall et al.,Matrix Reactions of Methylsilanes and Oxygen Atoms, 92 J. Phys. Chem. 594-602 (1988).
Hausmann et al., “Catalytic vapor deposition of highly conformal silica nanolaminates”, Department of Chemistry and Chemical Biology, Harvard University, May 14, 2002, pp. 1-13.
Hausmann et al.,Rapid Vapor Deposition of Highly Conformal Silica Nanolaminates, 298 Science 402-406 (Oct. 11, 2002).
Miller et

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