Electric heating – Microwave heating – Cookware
Reexamination Certificate
2008-01-15
2008-01-15
Leung, Philip H. (Department: 3742)
Electric heating
Microwave heating
Cookware
C219S728000, C099SDIG014, C426S107000, C426S234000, C426S243000
Reexamination Certificate
active
07319213
ABSTRACT:
Indentation patterns in microwave packaging materials can enhance the baking and browning effects of the microwave packaging materials on food. The indentation patterns can provide venting to either channel moisture from one area of the food product to another, trap moisture in a certain area to prevent it from escaping, or channel the moisture completely away from the food product. The indentation patterns can cause the microwave packaging material underneath a food product to be slightly elevated above the cooking platform in the base of a microwave. The indentation patterns can lessen the heat sinking effect of the cooking platform by providing an air gap for insulation. Elevating the base of the microwave packaging material further allows more incident microwave radiation to propagate underneath the microwave packaging material to be absorbed by the food product or by microwave interactive materials in the microwave packaging material that augment the heating process.
REFERENCES:
patent: 4794005 (1988-12-01), Swiontek
patent: 5026958 (1991-06-01), Palacios
patent: 5217768 (1993-06-01), Walters et al.
patent: 5310977 (1994-05-01), Stenkamp et al.
patent: 5317118 (1994-05-01), Brandberg et al.
patent: 5350904 (1994-09-01), Kemske et al.
patent: 5585027 (1996-12-01), Young
patent: 5698127 (1997-12-01), Lai et al.
patent: 6150647 (2000-11-01), Anderson et al.
patent: 6204492 (2001-03-01), Zeng et al.
patent: 6919547 (2005-07-01), Tsontzidis et al.
patent: 2003/0085224 (2003-05-01), Tsontzidis et al.
patent: 3-505020 (1991-10-01), None
patent: WO 89/11772 (1989-11-01), None
patent: WO 01/22778 (2001-03-01), None
patent: WO 03/041451 (2003-05-01), None
patent: WO 2004/020310 (2004-03-01), None
Lai Laurence M. C.
Tsontzidis Sandra M.
Zeng Neilson
Graphic Packaging International, Inc.
Leung Philip H.
Womble Carlyle Sandridge & Rice PLLC
LandOfFree
Microwave packaging with indentation patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microwave packaging with indentation patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave packaging with indentation patterns will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2807536