Wiring substrate and method of manufacturing thereof, and...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S624000, C438S128000, C438S151000, C257S736000, C257SE21016

Reexamination Certificate

active

07371598

ABSTRACT:
The invention includes a first step for forming a first conductive layer composed of a high melting point metal to be in contact with an insulating layer; and a second step for forming a second conductive layer by discharging a composition containing a conductive material so as to be in contact with the first conductive layer. The first conductive layer is formed prior to forming the second conductive layer by droplet discharging, and hence, adhesiveness and peel resistance of the second conductive layer are improved. Furthermore, the insulating layer is covered with the first conductive layer, thereby preventing damage or destruction of the insulating layer.

REFERENCES:
patent: 6674171 (2004-01-01), Yamaguchi
patent: 6737363 (2004-05-01), Miyajima et al.
patent: 2004/0147113 (2004-07-01), Yamazaki et al.
patent: 2004/0263564 (2004-12-01), Maekawa et al.
patent: 2005/0045891 (2005-03-01), Yamazaki et al.
patent: 2005/0064633 (2005-03-01), Mikoshiba
patent: 2005/0095356 (2005-05-01), Nakamura et al.
patent: 2006/0158482 (2006-07-01), Nakamura et al.
patent: 1348207 (2002-05-01), None
patent: 1434508 (2003-08-01), None
patent: 07-105740 (1995-04-01), None
patent: 2001-133613 (2001-05-01), None
patent: 2001133613 (2001-05-01), None
T. Shimoda “Ink-Jet Technology for Fabrication Processes of Flat Panel Displays”, SID Digest '03; SID International Symposium Digest of Technical Papers, Jan. 2003, pp. 1178-1181.
Office Action (Application No. 200410083448.0 CN7391 Dated: Aug. 24, 2007) with FULL translation.

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