Semiconductor device and fabrication method thereof

Details Semiconductor device and fabrication method thereof Semiconductor device and fabrication method thereof

2008-03-11

2008-03-11

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000

Reexamination Certificate

active

07342309

ABSTRACT:
A semiconductor device has four levels of semiconductor chips stacked on a die pad of a lead frame. Specifically, the first, second, third and fourth semiconductor chips are stacked in turn. The first semiconductor chip shifts from the second semiconductor chip, and the third semiconductor chip shifts from the fourth semiconductor chip. An insulation spacer is placed between the second and third semiconductor chips. The four semiconductor chips are located within the confinement of the die pad. The semiconductor chips, spacer and die pad are sealed in with resin sealing material. Signals are transmitted between the upper semiconductor chip (second semiconductor chip or fourth semiconductor chip) and the lower semiconductor chip (first semiconductor chip or third semiconductor chip) via a plurality of electrode pads connected by wires. Preferably, the first sides, which are the edges of the second and third semiconductor chips, overlap when viewed from the top.

REFERENCES:
patent: 5471369 (1995-11-01), Honda et al.
patent: 6407456 (2002-06-01), Ball
patent: 7009303 (2006-03-01), Kuroda et al.
patent: 04-116859 (1992-04-01), None
patent: 2000-058743 (2000-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and fabrication method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2799600