Plasma processing apparatus and electrode used therein

Details Plasma processing apparatus and electrode used therein Plasma processing apparatus and electrode used therein

2011-08-30

2011-08-30

Paschall, Mark H (Department: 3742)

Electric heating

Metal heating

By arc

C219S121520, C219S121430, C219S121410, C118S7230IR, C118S7230AN, C156S345470

Reexamination Certificate

active

08008596

ABSTRACT:
A plasma processing apparatus performs a specific plasma processing on a target substrate by disposing a first and a second electrode to face each other in a processing chamber, and supplying high-frequency electric power to at least one of the first and the second electrodes to thereby generate a plasma while introducing a processing gas onto the target substrate supported by the second electrode. The electrode for use as the first electrode includes: an electrode plate facing the second electrode; a support for supporting the electrode plate, wherein the support is in contact with a surface of the electrode plate and the surface is opposite to the second electrode; and a dielectric portion, provided on a contact surface of the support with the electrode plate, and having a shape in which a center portion thereof has a height different from that of an edge portion thereof.

REFERENCES:
patent: 6228438 (2001-05-01), Schmitt
patent: 7525787 (2009-04-01), Dhindsa et al.
patent: 7784426 (2010-08-01), Schmitt
patent: 2005/0276928 (2005-12-01), Okumura et al.
patent: 2001-298015 (2001-10-01), None
patent: 2003-504842 (2003-02-01), None
patent: 2006-41088 (2006-02-01), None
patent: 10-2005-0094475 (2005-09-01), None
Office Action issued Nov. 24, 2010, in Japanese Patent Application No. 2006-072384.

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