Integration of thin film resistors having different TCRs...

Details Integration of thin film resistors having different TCRs... Integration of thin film resistors having different TCRs...

2008-03-18

2008-03-18

Lee, K. Richard (Department: 2832)

Electrical resistors

Resistance value temperature-compensated

With additional compensating resistor or resistance element

C438S382000, C438S384000, C257S363000, C257S516000

Reexamination Certificate

active

07345573

ABSTRACT:
An integrated circuit structure including multiple thin film resistors having different sheet resistances and TCRs includes a first oxide layer (2) formed on a semiconductor substrate (1), a first thin film resistor (3) disposed on the first oxide layer (2), and a second oxide layer (14) disposed over the first oxide layer (2) and first thin film resistor (3). A second thin film resistor (15) is formed on the second oxide layer (14) and a third oxide layer (16) is formed over the second thin film resistor (15) and the second oxide layer (14). Interconnect metallization elements (12A,B &22A,B) disposed on at least one of the second (14) and third (16) oxide layers electrically contact the circuit element (4), terminals of the first thin film resistor (3), and terminals of the second thin film resistor (15), respectively, through corresponding contact openings through at least one of the second (14) and third (16) oxide layers.

REFERENCES:
patent: 4019168 (1977-04-01), Collins
patent: 5729054 (1998-03-01), Summerfelt et al.
patent: 5976944 (1999-11-01), Czagas et al.
patent: 6211032 (2001-04-01), Redford et al.
patent: 6426268 (2002-07-01), Huppert et al.
patent: 6825092 (2004-11-01), Zurcher et al.

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