Topographically defined thin film CPP read head fabrication

Details Topographically defined thin film CPP read head fabrication Topographically defined thin film CPP read head fabrication

2008-03-18

2008-03-18

McPherson, John A (Department: 1756)

Joints and connections

Including ancillary means blocking disconnection of joint

C430S319000, C430S320000, C029S603160

Reexamination Certificate

active

07344330

ABSTRACT:
A method of constructing a small trackwidth magnetorsesistive sensor by defining a trench between first and second hard bias layers and depositing the sensor into the trench.

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“Method of Making Submicron Channel MOSFET”, IBM Technical Disclosure Bulletin, pp. 3407-3408, Dec. 1981.

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