Method for manufacturing semiconductor apparatus and mold...

Details Method for manufacturing semiconductor apparatus and mold... Method for manufacturing semiconductor apparatus and mold...

2011-08-16

2011-08-16

Booth, Richard A. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S027000, C438S064000, C438S068000, C438S127000, C438S460000, C257SE21502

Reexamination Certificate

active

07998763

ABSTRACT:
A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate. Then, a multi-piece product of semiconductor apparatuses can be removed from the molds and cut by a dicer to separate the individual semiconductor apparatuses.

REFERENCES:
patent: 7892869 (2011-02-01), Chuang et al.
patent: 2006/0261366 (2006-11-01), Yang
patent: 2002-344030 (2002-11-01), None
patent: 2003-31854 (2003-01-01), None
patent: 2006-324623 (2006-11-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor apparatus and mold... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor apparatus and mold..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor apparatus and mold... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2791332