Method and apparatus for drying a thick wet layer coated on one

Details Method and apparatus for drying a thick wet layer coated on one Method and apparatus for drying a thick wet layer coated on one

1979-07-02

1981-01-06

Schwartz, Larry I.

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

219 1041, 219 1061R, 219 1081, 427 451, 118620, F26B 334

Patent

active

042428050

ABSTRACT:
A method for drying a thick wet layer coated on one face of a cardboard sheet, the method being, of the type in which the coated cardboard sheet is fed continuously and a high frequency electric field is applied thereto in such manner that the lines of force of said electric field go only through said thick layer to selectively heat said layer, wherein a further electric field is applied to the coated cardboard sheet in such manner that the lines of force thereof go at least through the cardboard sheet. The method includes starting to apply the further electric field before the first mentioned electric field is applied. Apparatus for performing the method is additionally provided, the apparatus including at least one pair of oppositely polarized electrodes positioned along one face of the cardboard sheet and a second pair of oppositely polarized electrodes positioned along the opposed face of the cardboard sheet.

REFERENCES:
patent: 2588218 (1952-04-01), Dippel et al.
patent: 2678897 (1954-05-01), Mann et al.
patent: 3681558 (1972-08-01), Grassman
patent: 3740257 (1973-06-01), Roscher
patent: 3859494 (1975-01-01), Spengler

Affiliated with

Also associated with

Rating

Method and apparatus for drying a thick wet layer coated on one does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for drying a thick wet layer coated on one , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for drying a thick wet layer coated on one will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-278899