Manufacture of solid state electronic components

Details Manufacture of solid state electronic components Manufacture of solid state electronic components

2008-01-29

2008-01-29

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S396000, C438S458000, C257SE21567, C361S328000

Reexamination Certificate

active

07323395

ABSTRACT:
The present invention concerns methodologies for the mass production of solid state components, in particular capacitors, although other component types including, but not limited to, diodes and resistors may be produced. According to one aspect of the method of manufacturing first and second substrates are provided with a plurality of first and second solid state electronic component elements formed on a surface of each substrate. The first and second substrates are aligned so that respective first and second component elements are each mutually aligned, and the first and second substrates are fixed together, so that the first and second elements are operatively connected one to another, thereby forming a substrate sandwich. The substrate sandwich may be divided to form a plurality of individual components, each comprising a first component element cooperatively connected to a second component element.

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patent: 5824571 (1998-10-01), Rollender et al.
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patent: WO0122451 (2001-03-01), None

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