Transparent conductive multi-layer structure, process for...

Details Transparent conductive multi-layer structure, process for... Transparent conductive multi-layer structure, process for...

2011-03-08

2011-03-08

Tucker, Philip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S237000, C156S239000, C156S241000, C156S307500, C428S212000, C428S690000, C428S691000, C136S263000, C257S750000, C313S503000, C313S506000, C313S498000, C313S512000

Reexamination Certificate

active

07901538

ABSTRACT:
A transparent conductive multi-layer structure having a smooth base material1, a transparent conductive layer2formed on the smooth base material1by coating, an auxiliary electrode layer3formed in a pattern on the transparent conductive layer2, and a transparent substrate5joined to the transparent conductive layer2and auxiliary electrode layer3through an adhesive layer4. On a smooth peeled-off surface of the transparent conductive layer2from which the smooth base material1has been peeled off, various devices are formed to set up devices such as a dye-sensitized solar cell and an organic electroluminescent device.

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