Semiconductor device having an oxide film formed on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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Details

C257S390000, C257S374000, C257S506000, C257SE29300

Reexamination Certificate

active

07315073

ABSTRACT:
A first isolation is formed on a semiconductor substrate, and a first element region is isolated via the first isolation. A first gate insulating film is formed on the first element region, and a first gate electrode is formed on the first gate insulating film. A second isolation is formed on the semiconductor substrate, and a second element region is isolated via the second isolation. A second gate insulating film is formed on the second element region, and a second gate electrode is formed on the second gate insulating film. A first oxide film is formed between the first isolation and the first element region. A second oxide film is formed between the second isolation and the second element region. The first isolation has a width narrower than the second isolation, and the first oxide film has a thickness thinner than the second oxide film.

REFERENCES:
patent: 6613647 (2003-09-01), Kim
patent: 2004/0104421 (2004-06-01), Ozawa et al.
patent: 2002-141409 (2002-05-01), None
patent: 2002-252291 (2002-09-01), None
patent: 2004-510330 (2004-04-01), None
patent: 2004-186185 (2004-07-01), None
patent: 2006-121023 (2005-05-01), None

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