Semiconductor device fabricating method and fabricating...

Details Semiconductor device fabricating method and fabricating... Semiconductor device fabricating method and fabricating...

2011-08-23

2011-08-23

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S108000, C257SE21499

Reexamination Certificate

active

08003437

ABSTRACT:
Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.

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