Semiconductor cooling device and stack of semiconductor...

Details Semiconductor cooling device and stack of semiconductor... Semiconductor cooling device and stack of semiconductor...

2008-04-29

2008-04-29

Zarroli, Michael C. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C257S706000

Reexamination Certificate

active

07365986

ABSTRACT:
To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a semiconductor cooling device includes at least an upper plate, an intermediate plate and a lower plate, and has a coolant inlet portion, an outlet portion and a flow passage portion. The upper plate and the lower plate are composite plates constituted by plating copper maintaining a thickness of not smaller than 0.05 mm on one surface or on both surfaces of auxiliary plates made of a material having a tensile strength of not smaller than 1000 N/mm2, a heat conductivity of not smaller than 100 W/m·K and a coefficient of thermal expansion of not larger than 6.0 ppm/° C.

REFERENCES:
patent: 4559580 (1985-12-01), Lutfy
patent: 5098305 (1992-03-01), Krajewski et al.
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 5665473 (1997-09-01), Okoshi et al.
patent: 7114550 (2006-10-01), Nakahama et al.
patent: 2006/0108100 (2006-05-01), Goldman et al.
patent: 11-97770 (1999-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor cooling device and stack of semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor cooling device and stack of semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor cooling device and stack of semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2771192