Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-15
2008-04-15
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S846000, C029S851000, C174S255000, C361S794000
Reexamination Certificate
active
07356917
ABSTRACT:
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
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Harada Toshikazu
Kondo Koji
Denso Corporation
Nguyen Donghai D.
Posz Law Group , PLC
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