Ceramic package used for semiconductor chips different in layout

Details Ceramic package used for semiconductor chips different in layout Ceramic package used for semiconductor chips different in layout

1996-08-21

1998-09-01

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361820, 257692, 257786, 174261, H05K 706

Patent

active

058019278

ABSTRACT:
A ceramic case includes a plurality of stitches divided into a central sub-group shared between different kinds of semiconductor chips and side sub-groups selectively used for the different kinds of semiconductor chip, and the side sub-groups enhance the compatibility of the ceramic case.

REFERENCES:
patent: 3716761 (1973-02-01), Rotast
patent: 4489365 (1984-12-01), Daberkoe

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