Mounting multichip and single chip modules on printed wiring boa

Details Mounting multichip and single chip modules on printed wiring boa Mounting multichip and single chip modules on printed wiring boa

1997-03-14

1998-09-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361715, 361718, 361719, 361770, 257711, 257717, 174138G, 174252, H05K 720

Patent

active

058019235

ABSTRACT:
A multichip module is attached to a printed wire circuit board using three conductive mounting feet that are vapor phase soldered to conductive feet on the module's substrate and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.

REFERENCES:
patent: 4748538 (1988-05-01), Tsuji
patent: 5459639 (1995-10-01), Izumi

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