Semiconductor device package

Details Semiconductor device package Semiconductor device package

1991-05-08

1992-03-03

LaRoche, Eugene R.

357 74, 357 72, H01L 2316

Patent

active

050937138

ABSTRACT:
A semiconductor device package includes a first semiconductor chip. The first semiconductor chip is mounted on a substrate island region. A lead frame is arranged to serve as an external terminal of the first semiconductor chip, and includes an island region for mounting at least one second semiconductor chip.

REFERENCES:
patent: 3639770 (1972-02-01), Zizelmann
patent: 3715633 (1973-02-01), Nier
patent: 3935501 (1976-01-01), Sterbal
patent: 4032964 (1977-06-01), Boeters
patent: 4128801 (1978-12-01), Gansert
patent: 4203792 (1980-04-01), Thompson

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