Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-05-06
2008-05-06
Le, Thao X. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C439S066000, C361S760000
Reexamination Certificate
active
07368814
ABSTRACT:
An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package) and providing an interconnect device. Interconnect elements extend through a substrate of the interconnect device and are electrically connected to conductive pads on a second side of the high density interconnect board.
REFERENCES:
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 5418471 (1995-05-01), Kardos
patent: 5479319 (1995-12-01), Werther
patent: 5645433 (1997-07-01), Johnson
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5712768 (1998-01-01), Werther
patent: 5742481 (1998-04-01), Murphy et al.
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5876219 (1999-03-01), Taylor et al.
patent: 5892245 (1999-04-01), Hilton
patent: 5982635 (1999-11-01), Menzies et al.
patent: 6007348 (1999-12-01), Murphy
patent: 6325280 (2001-12-01), Murphy
patent: 6462573 (2002-10-01), McAllister et al.
patent: 2003/0032310 (2003-02-01), Weiss et al.
patent: 2004/0242030 (2004-12-01), Palaniappa et al.
patent: 2005/0196979 (2005-09-01), Fedde et al.
U.S. Appl. No. 11/069,102, filed Mar. 1, 2005, Fedde et al.
“Supermax E-CAD Buried/Blind vias.” datasheet [online]. Dansk Data Elektronik A/S , Herlev Hovedgade, 199, DK-2730 Herlev, DENMARK, retrieved on Mar. 23, 2005. Retrieved from the Internet:<URL: www.dde-eda.com/ecadman8/ipl/appendx—10.html>; 2 pgs.
“Ironwood C4882 Drawing”, 1 page, provided to customer in Dec. 2002.
Patil Ranjit R.
Tully Michael J.
Crawford Latanya
Ironwood Electronics, Inc.
Le Thao X.
Mueting Raasch & Gebhardt, P.A.
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