Alicyclic diepoxy compound, epoxy resin composition...

Details Alicyclic diepoxy compound, epoxy resin composition... Alicyclic diepoxy compound, epoxy resin composition...

2011-08-02

2011-08-02

Feely, Michael J (Department: 1761)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S400000, C528S219000, C528S271000

Reexamination Certificate

active

07989523

ABSTRACT:
Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3′,4′-diepoxybicyclohexyl compound represented by following Formula (1):wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3′,4′-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3′,4′-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.

REFERENCES:
patent: 7781543 (2010-08-01), Maeshima et al.
patent: 2006/0009547 (2006-01-01), Maeshima et al.
patent: 2010/0216912 (2010-08-01), Oka
patent: 2000-169399 (2000-06-01), None
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patent: 2005-097274 (2005-04-01), None
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Machine translation of JP 2000-169399 A, provided by the JPO website (no date).
Extended European Search Report issued Aug. 16, 2010, in counterpart EP 07767896.9 (including Supplementary European Search Report and European Search Opinion).

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