Semiconductor device substrate, semiconductor device, and...

Details Semiconductor device substrate, semiconductor device, and... Semiconductor device substrate, semiconductor device, and...

2008-04-15

2008-04-15

Menz, Douglas M. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S616000

Reexamination Certificate

active

07358114

ABSTRACT:
A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

REFERENCES:
patent: 4283987 (1992-10-01), None
patent: 2003197809 (2003-07-01), None

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