Method of mounting electronic component

Details Method of mounting electronic component Method of mounting electronic component

2008-04-01

2008-04-01

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S001100

Reexamination Certificate

active

07350685

ABSTRACT:
The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

REFERENCES:
patent: 6247628 (2001-06-01), Sato et al.
patent: 6482279 (2002-11-01), Nakano et al.
patent: 6494976 (2002-12-01), Hayashi et al.
patent: 6811630 (2004-11-01), Tominaga et al.
patent: 7017791 (2006-03-01), Higashiyama
patent: 7150388 (2006-12-01), Matsumura
patent: 2003/0057537 (2003-03-01), Iwasaki et al.
patent: 2002-313834 (2002-10-01), None
patent: 2003-100803 (2003-04-01), None

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