Package on-package secure module having BGA mesh cap

Details Package on-package secure module having BGA mesh cap Package on-package secure module having BGA mesh cap

2011-01-11

2011-01-11

Stark, Jarrett J (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S738000, C257SE23023, C257SE21476, C257SE21502, C438S108000, C438S613000

Reexamination Certificate

active

07868441

ABSTRACT:
A package-on-package (POP) secure module includes a BGA mesh cap, a first BGA package, and a second BGA package. The first BGA package includes a first integrated circuit (for example, a microcontroller that includes tamper detect logic). The second BGA package includes a second integrated circuit (for example, a memory). The second BGA package is piggy-back mounted to the first BGA package and the BGA mesh cap is piggy-back mounted to the second BGA package. A printed circuit board substrate member of the BGA mesh cap includes an embedded anti-tamper mesh. This mesh is connected in a protected manner within the module to the first integrated circuit. When the module is in use, a mesh embedded in an underlying printed circuit board is coupled to the BGA cap mesh so that both anti-tamper meshes are controlled by the tamper detect logic.

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