Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S773000, C257SE27070, C438S585000, C438S149000, C438S618000, C438S648000

Reexamination Certificate

active

07969012

ABSTRACT:
A method for easily manufacturing a semiconductor device in which variation in thickness or disconnection of a source electrode or a drain electrode is prevented is proposed. A semiconductor device includes a semiconductor layer formed over an insulating substrate; a first insulating layer formed over the semiconductor layer; a gate electrode formed over the first insulating layer; a second insulating layer formed over the gate electrode; an opening which reaches the semiconductor layer and is formed at least in the first insulating layer and the second insulating layer; and a step portion formed at a side surface of the second insulating layer in the opening.

REFERENCES:
patent: 5121186 (1992-06-01), Wong et al.
patent: 5338702 (1994-08-01), Kobeda et al.
patent: 5341028 (1994-08-01), Yamaguchi et al.
patent: 5583366 (1996-12-01), Nakazawa
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5940690 (1999-08-01), Kusumoto et al.
patent: 5940732 (1999-08-01), Zhang
patent: 6001683 (1999-12-01), Lee
patent: 6043164 (2000-03-01), Nguyen et al.
patent: 6187663 (2001-02-01), Yu et al.
patent: 6235628 (2001-05-01), Wang et al.
patent: 6284591 (2001-09-01), Lee
patent: 6294799 (2001-09-01), Yamazaki et al.
patent: 6337232 (2002-01-01), Kusumoto et al.
patent: 6388291 (2002-05-01), Zhang et al.
patent: 6433361 (2002-08-01), Zhang et al.
patent: 6455875 (2002-09-01), Takemura et al.
patent: 6521533 (2003-02-01), Morand et al.
patent: 6541795 (2003-04-01), Kusumoto et al.
patent: 6707107 (2004-03-01), Kido
patent: 6740599 (2004-05-01), Yamazaki et al.
patent: 6841315 (2005-01-01), Imura
patent: 6882018 (2005-04-01), Ohtani et al.
patent: 6911688 (2005-06-01), Yamazaki et al.
patent: 6972263 (2005-12-01), Yamazaki et al.
patent: 6992332 (2006-01-01), Yamazaki et al.
patent: 7038239 (2006-05-01), Murakami et al.
patent: 7125654 (2006-10-01), IIirota
patent: 7223666 (2007-05-01), Ohtani et al.
patent: 7238557 (2007-07-01), Hayakawa
patent: 7242021 (2007-07-01), Yamazaki et al.
patent: 7297629 (2007-11-01), Wang
patent: 2001/0033001 (2001-10-01), Kato
patent: 2003/0189210 (2003-10-01), Yamazaki et al.
patent: 2003/0193054 (2003-10-01), Hayakawa et al.
patent: 2005/0118827 (2005-06-01), Sato et al.
patent: 2006/0060861 (2006-03-01), Yamazaki et al.
patent: 2006/0255465 (2006-11-01), Kishiro
patent: 2007/0210451 (2007-09-01), Ohtani et al.
patent: 2007/0228374 (2007-10-01), Hayakawa
patent: 2008/0237875 (2008-10-01), Yamazaki et al.
patent: 02-076264 (1990-03-01), None
patent: 05-013762 (1993-01-01), None
patent: 07-335906 (1995-12-01), None
patent: 08-018055 (1996-01-01), None
patent: 09-135005 (1997-05-01), None
patent: 2003-218362 (2003-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2743411

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.