Phenolic resin, production method and use thereof

Details Phenolic resin, production method and use thereof Phenolic resin, production method and use thereof

2011-08-09

2011-08-09

Jagannathan, Vasu (Department: 1764)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

C528S086000, C528S129000, C528S155000, C525S523000, C525S107000, C525S480000, C525S481000, C525S068000, C521S181000

Reexamination Certificate

active

07994271

ABSTRACT:
Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

REFERENCES:
patent: 2003/0069357 (2003-04-01), Kaji et al.
patent: 6-136082 (A) (1994-05-01), None
patent: 9-157353 (A) (1997-06-01), None
patent: 2000-129092 (A) (2000-05-01), None
patent: 2000-212259 (A) (2000-08-01), None
patent: 2000-226498 (A) (2000-08-01), None
patent: 2001-064340 (A) (2001-03-01), None
Machine translation of JP 2000-212259.
Machine translation of JP 2001-064340.
International Preliminary Report on Patentability and Written Opinion issued in corresponding application No. PCT/JP2006/320581 dated Apr. 16, 2008.
* Form PC.T/ISA/210 (International Search Report) dated Jan. 9, 2007.

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