Light emitting diode structure having a textured package lens

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257S095000, C257S099000, C257S434000, C257SE33065, C257SE33068, C257SE33073, C257SE33074

Reexamination Certificate

active

07956375

ABSTRACT:
A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.

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English language translation of abstract of CN 1527408 (published Sep. 8, 2004).
Chinese language office action dated Jun. 5, 2009.
English language translation of abstract and pertinent parts of JP 2006-048165.

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