Packaged microelectronic devices and methods for...

Details Packaged microelectronic devices and methods for... Packaged microelectronic devices and methods for...

2011-06-28

2011-06-28

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S123000

Reexamination Certificate

active

07968376

ABSTRACT:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.

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