Transferring device and transferring method

Details Transferring device and transferring method Transferring device and transferring method

2011-01-25

2011-01-25

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S306300, C156S323000, C156S345420, C156S391000, C156S537000, C156S538000, C156S539000, C156S540000, C156S556000, C156S580000, C156S583200

Reexamination Certificate

active

07875144

ABSTRACT:
A transferring device10for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2and the third table T3. The transferring device10includes a supporting unit11provided with a supporting face for a semiconductor wafer W, and a multi joint robot12for transferring the supporting unit11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1through T3can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.

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