Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-01-18
2011-01-18
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C024S458000, C165S080300
Reexamination Certificate
active
07872870
ABSTRACT:
An electronic device comprises a printed circuit board, an electronic component mounted on the printed circuit board, a heat dissipation device dissipating heat generated by the electronic component and a plurality of wires on the printed circuit board. The heat dissipation device comprises a heat sink and a pair of fasteners securing the heat sink to the printed circuit board. Each fastener comprises a frame body having a gap defined at a top portion thereof. The wires in a form of a wire harness extend through the gap of the frame body and into the frame body.
REFERENCES:
patent: 5881800 (1999-03-01), Chung
patent: 6112378 (2000-09-01), Lee
patent: 6246584 (2001-06-01), Lee et al.
patent: 6334750 (2002-01-01), Hsieh
patent: 6885805 (2005-04-01), Asada
patent: 7011277 (2006-03-01), Mizukoshi et al.
patent: 7036775 (2006-05-01), Nakanishi
patent: 7045715 (2006-05-01), Ono
patent: 7145112 (2006-12-01), Daughtry et al.
patent: 7219931 (2007-05-01), Kato
Liu Jian
Zhang Jing
Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
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