Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Reexamination Certificate
2011-08-09
2011-08-09
Van, Luan V (Department: 1724)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
C205S125000
Reexamination Certificate
active
07993510
ABSTRACT:
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.
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Supplemental European Search Report dated Jun. 29, 2006.
Machine English translation of JP Hei-07-079078.
Machine English translation of JP Hei-09-312472.
Ibiden Co. Ltd.
Sughrue & Mion, PLLC
Van Luan V
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