Method of forming a dielectric layer on a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Reexamination Certificate

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C257SE33004

Reexamination Certificate

active

07989824

ABSTRACT:
A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is formed. A first metal contact is formed on a portion of the n-type region and a second metal contact is formed on a portion of the p-type region. The first and second metal contacts are formed on a same side of the semiconductor structure. A dielectric material is disposed between the first and second metal contacts. The dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact. A planar surface is formed including a surface of the first metal contact, a surface of the second metal contact, and a surface of the dielectric material

REFERENCES:
patent: 6891197 (2005-05-01), Bhat et al.
patent: 7220608 (2007-05-01), Oohata
patent: 2006/0240585 (2006-10-01), Epler et al.
patent: 2007/0096130 (2007-05-01), Schiaffino et al.
patent: 2008/0081397 (2008-04-01), Sun et al.
patent: 2008/0173884 (2008-07-01), Chitnis et al.
patent: 102007003282 (2007-01-01), None
patent: 2009020365 (2009-02-01), None

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