Embedded die package and process flow using a pre-molded...

Details Embedded die package and process flow using a pre-molded... Embedded die package and process flow using a pre-molded...

2011-01-04

2011-01-04

Hoang, Quoc D (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S614000, C257SE21507, C257SE21508

Reexamination Certificate

active

07863096

ABSTRACT:
An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal conductors, each of which is in contact with at least one of the vias, one or more additional dielectric layers lying over the metal conductors and the first dielectric layer, wherein a top layer of the one or more dielectric layers has openings with metalization underneath coupled to at least one of the metal conductors, and solder bumps protruding from each of the openings.

REFERENCES:
patent: 7011988 (2006-03-01), Forcier
patent: 7208344 (2007-04-01), Ho
patent: 7350296 (2008-04-01), Ryu et al.
patent: 7371610 (2008-05-01), Fan et al.
patent: 7655500 (2010-02-01), Jiang et al.
patent: 2006/0046347 (2006-03-01), Wood et al.
patent: 2007/0158861 (2007-07-01), Huang et al.
patent: 2008/0251903 (2008-10-01), Otremba et al.
Taylor, Jack “Breakthrough Technology from Freescale Redefines State of the Art for Advanced Semiconductor Packaging Innovative Approach Could Replace Ball Grid Array and Flip Chip as preferred Packaging Technology for Miniaturized Devices”, as printed from the WorldWideWeb on Jun. 12, 2008 at http://media.freescale.com/phoenix.zhtml?c=196520&p=irol-newsArticle—print&ID=8858 . . . , pp. 1 and 2.
Freescale Semiconductor article entitled “Redistributed Chip Package (RCP) Technology”, 6 pages.

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